Organic element and manufacturing method thereof

ABSTRACT

An organic EL display panel having a functional layer with a uniform film thickness is provided. The organic EL display panel of the present invention contains an anode electrode set on a substrate; line-state banks set on the substrate on which the anode electrode is set and defining a line-state region; a hole transport layers arranged in matrix state on the substrate, the hole transport layer being set in the line-state region; a line-state interlayer set in the line-state region; a line-state organic EL layer set in the line-state region; and a cathode electrode provided on the organic EL layer, and the bank contains a fluorine resin.

TECHNICAL FIELD

The present invention relates to an organic device such as an organic EL(OEL) element, an organic EL display panel and the like and amanufacturing method thereof.

BACKGROUND ART

An organic device such as an organic semiconductor element, OEL elementand the like usually has a functional layer containing an organicfunctional material set between an anode and a cathode. According tofunctions of the organic functional material, an organic device can beclassified into a semiconductor element (transistor), a light-emittingelement, a liquid crystal element and the like. The semiconductorelement has an organic semiconducting material connecting a sourceelectrode and a drain electrode set on a substrate surface, for example;and the organic EL element has a light emitting layer containing anorganic EL material set between the anode electrode set on the substratesurface and the cathode electrode.

In order to pattern the organic functional material on the electrode, abarrier (that is, a bank) surrounding an electrode is formed, and acomposition containing the organic functional material is applied to aregion defined by the banks in some cases. A material of the bank may bea resin.

When ink containing the organic functional material is applied to theregion including the electrode surface defined by the banks, it ispreferable that the region to be coated (including the electrodesurface) has high lyophilicity and the upper surface of the bank has lowlyophilicity in general. That is to prevent the ink from leaking to theoutside of the targeted region.

In general, a fluorine component is known to decrease the energy and thelyophilicity of a substance surface. The method to subject the banksurface to plasma-treatment with a fluorocarbon gas in order to decreasethe lyophilicity of an upper surface of the bank, is known (See PatentDocument 1). However, if the bank surface is plasma-treated with thefluorocarbon gas, usually, fluorine is not chemically bonded to asurface of the material of a bank but just adsorbed to the materialsurface by an intermolecular force. Therefore, even if fluorine isadsorbed to the material surface by plasma treatment, fluorine migrationmay occur by thermal process or the like. If fluorine is migrated to anorganic functional layer of an organic device, for example, itdeteriorates device property. Particularly, if a fluorine atom withlarge electron withdrawing is mixed in an organic light emitting layer,there is a fear that a light emitting exciter is deactivated and lightemission efficiency or the like is adversely affected.

As means for solving the above problems, forming a bank using afluorinated photoresist is proposed (See Patent Document 2). The bankformed with a photolithography process which comprises application stepof applying fluorinated photoresist; development step; washing step;calcination step and the like has a feature that lyophilicity is loweven without plasma treatment.

Patent Document 1: Japanese Patent Laid-Open Publication No. 2005-52835Patent Document 2: Japanese Patent Application Laid-Open No. 2005-522000DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

As mentioned above, since the bank using the fluorinated photoresist haslow lyophilicity, it is suitable for banks defining the region to whichan organic material is applied. However, lyophilicity on a wall surfaceof the bank has been low in some cases in the bank using the fluorinatedphotoresist. Thus, if an organic material is applied so as to form afunctional layer in a region defined by banks, the applied organicmaterial is repelled by the wall surface of the bank and a functionallayer having a uniform film thickness has not been formed in a desiredregion in some cases.

The present invention has an object to form a functional layer having auniform film thickness in a region defined by banks by controllinglyophilicity at a wall surface of the bank when the bank is formed usinga fluorine photoresist.

Means for Solving the Problem

That is, the first aspect of the present invention relates to an organicdisplay panel mentioned below:

[1] An organic EL display panel containing an anode electrode set on asubstrate; line-state banks defining a line state region set on thesubstrate on which the anode electrode is set; a hole transport layersarranged in matrix state on the substrate, the hole transport layerbeing set in the line-state region; a line-state interlayer set in theline-state region; a line-state organic EL layer set in the line-stateregion; and a cathode electrode provided on the organic EL layer, inwhich the bank contains a fluorine resin.[2] The organic EL display panel described in [1] further comprising aninsulating inorganic film, wherein a material of the hole transportlayer contains polyethylenedioxythiophene, and the insulating inorganicfilm protrudes from the line-state bank into the line-state region andis in contact with a bottom surface of the hole transport layer.[3] The organic EL display panel described in [1] further comprising aninsulating inorganic film, wherein a material of the hole transportlayer contains tungsten oxide (WO_(x)), molybdenum oxide (MoO_(x)),vanadium oxide (VO_(x)) or a combination of them, and the insulatinginorganic film protrudes from the line-state bank into the line-stateregion and is in contact with a bottom surface of the line-stateinterlayer.[4] The organic EL display panel described in [1] or [2] wherein amaterial of the hole transport layer containspolyethylenedioxythiophene; a second bank defining two or more pixelregions in the line-state region is further provided; the pixel regiondefines the hole transport layer; the second bank has a grooveconnecting the pixel regions with each other; anda height of the second bank from the substrate is smaller than theheight of the line-state bank from the substrate.[5] The organic EL display panel described in [1] or [3] furthercomprising a second bank defining two or more pixel regions in theline-state region, wherein a material of the hole transport layercontains tungsten oxide (WO_(x)), molybdenum oxide (MoO_(x)), vanadiumoxide (VO_(x)) or a combination of them; the pixel region defines theinterlayer and the organic EL layer; the second bank has a grooveconnecting the pixel regions with each other; and a height of the secondbank from the substrate is smaller than the height of the line-statebank from the substrate.[6] The organic EL display panel described in any of [1] to [5], whereina fluorine concentration of the fluorine resin gradually changes along athickness direction of the bank; and the fluorine concentration at a topof the bank is higher than the fluorine concentration at a bottomsurface of the bank.[7] The organic device described in any of [1] to [6], wherein thefluorine concentration at the top of the bank is 5 to 10 atom % and thefluorine concentration at the bottom surface of the resin bank is 0 to 3atom %.[8] The organic EL display panel described in any of [1] to [7], whereinthe bank is in a forward tapered shape.

The second aspect of the present invention relates to a manufacturingmethod of an organic display panel mentioned below:

[9] A manufacturing method of an organic EL display panel including thesteps of forming an anode electrode on a substrate; forming line-statebanks defining a line-state region and containing a fluorine resin onthe substrate so as to expose the anode electrode; forming matrix-statehole transport layers on the substrate; forming a line-state interlayerin the line-state region; applying an ink containing an organic ELmaterial and a solvent to the line-state region with ink-jet, dispenser,nozzle coating, intaglio printing or letterpress printing in a linestate to form a line-state organic EL layer in the line-state region;and forming a cathode electrode on the organic EL layer, in which amaterial of the hole transport layer containspolyethylenedioxythiophene.[10] A manufacturing method of an organic EL display panel including thesteps of forming an anode electrode on a substrate; forming matrix-statehole transport layers on the substrate; forming line-state banksdefining a line-state region and containing a fluorine resin on thesubstrate so as to expose the hole transport layer; forming a line-stateinterlayer in the line-state region; applying an ink containing anorganic EL material and a solvent to the line-state region with ink-jet,dispenser, nozzle coating, intaglio printing or letterpress printing ina line state to form a line-state organic EL layer in the line-stateregion; and forming a cathode electrode on the organic EL layer, inwhich a material of the hole transport layer contains tungsten oxide(WO_(x)), molybdenum oxide (MoO_(x)), vanadium oxide (VO_(x)) or acombination of them.

EFFECT OF THE INVENTION

Since the organic device of the present invention has a bank containinga fluorine resin with low lyophilicity of an upper surface, a materialof a functional layer applied to a region defined by the banks does notleak to another region. In addition, since the lyophilicity of the wallsurface of the bank is higher than that of the upper surface of thebank, a functional layer with uniform thickness is formed. Particularly,by forming the bank containing the fluorine resin provided at theorganic device of the present invention in the forward tapered shape,the lyophilicity of the bank gradually changes along the thickness (thelarger the thickness is, the lower the lyophilicity becomes), and auniform functional layer is easily formed.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram illustrating an organic EL element having a bank ina forward tapered shape;

FIG. 2 is a diagram illustrating the organic EL element having a bank ina forward tapered shape which has two inflection points;

FIG. 3 is a diagram of the organic EL element having an inorganicinsulating film;

FIG. 4 is a diagram of the organic EL element having an inorganicinsulating film;

FIG. 5 is a plane view of an organic EL display panel of the presentinvention;

FIG. 6 is a plan view of the organic EL display panel of the presentinvention, from which a cathode electrode, an organic EL layer and aninterlayer are removed;

FIG. 7A is a sectional view of the organic EL display panel of thepresent invention;

FIG. 7B is a sectional view of the organic EL display panel of thepresent invention;

FIG. 8A is a sectional view of the organic EL display panel of thepresent invention;

FIG. 8B is a sectional view of the organic EL display panel of thepresent invention; and

FIG. 9 is a diagram illustrating an organic semiconductor element of thepresent invention.

BEST MODE FOR CARRYING OUT THE INVENTION 1. Organic EL Element

An organic EL element of the present invention has a substrate, an anodeelectrode, a cathode electrode, a hole transport layer, an interlayer,an organic EL layer and a bank.

The organic EL element of the present invention may have a thin filmtransistor (driving TFT) for driving the organic EL element. The anodeelectrode of the organic EL element and a source or drain electrode ofthe driving TFT may be connected to each other.

A material of the substrate of the organic EL element of the presentinvention is different depending on whether the organic EL element is ofbottom emission type or of top emission type. In the case where theorganic EL element is of bottom emission type, the substrate is requiredto be transparent, therefore the substrate may be glass, transparentresin or the like. On the other hand, in the case where the organic ELelement is of top emission type, there is no need for the substrate tobe transparent, and any material can be used as long as the material isan insulant.

On the substrate, an anode electrode is formed. When the organic ELelement is of bottom emission type, the anode electrode is required tobe a transparent electrode, and it may be made of ITO or the like. Whenthe organic EL element is of top emission type, the anode electrode isrequired to reflect light, and it may be made of an alloy containingsilver or more specifically by a silver-palladium-copper alloy (alsoreferred to as APC), for example.

Over the anode electrode, a hole transport layer or an interlayer isset. Over the anode electrode, both the hole transport layer and theinterlayer may be set in this order. There may be a case where the holetransport layer is not formed.

The hole transport layer is a layer made of a hole transport material.Examples of the hole transport material include poly (3,4-ethylenedioxythiophene) doped with polystyrene sulfonic acid (alsoreferred to as PEDOT-PSS) and its derivative (copolymer or the like).The thickness of the hole transport layer is usually 10 nm or more and100 nm or less and may be approximately 30 nm.

A material of the hole transport layer may be a metal oxide such asWO_(x) (tungsten oxide), MoO_(x) (molybdenum oxide) VO_(x) (vanadiumoxide) or the like or a combination of them.

The interlayer has a role to block the transportation of electrons tothe hole transport layer and a role to efficiently transport holes tothe organic EL layer. The interlayer is a layer made of a polyanilinematerial, for example. The thickness of the interlayer is usually 10 nmor more and 100 nm or less and may preferably be approximately 40 nm.

The hole transport layer and the interlayer are set in a region definedby the banks, which will be described later.

On the interlayer, the organic EL layer is set. The organic materialcontained in the organic EL layer may be a low-molecular material orhigh-molecular (polymeric) material. In the case of the low-molecularorganic EL material, the organic material includes dopant material and ahost material. Examples of the dopant material include BCzVBi, coumarin,rubrene, DCJTB and the like, while examples of the host material includeDPVBi, Alq3 and the like.

Examples of the polymer organic EL material include poly phenylenevinylene and its derivatives, poly acetylene and its derivatives, polyphenylene and its derivatives, poly para phenylene ethylene and itsderivatives, poly 3-hexyl thiophene (P3HT) and its derivatives, polyfluorene (PF) and its derivatives and the like. The organic materialcontained in the organic EL layer is preferably a polymer organic ELmaterial.

The organic EL layer may be formed in a region defined by the banks,which will be described later.

The organic EL element of the present invention has banks definingregion of the interlayer and the organic EL layer as mentioned above.The bank is characterized by containing a fluorine resin. The fluorineresin contained in the bank is not particularly limited and it is onlynecessary that the resin has a fluorine atom in at least a part ofrepeating units in its polymer repeating units. Examples of the fluorineresin include fluorinated polyolefin resin, fluorinated polyimide resin,fluorinated polyacrylic resin and the like. More specific examples ofthe fluorine resin include a fluorine-containing polymer described inJapanese Patent Application Laid-Open No. 2002-543469; LUMIFLON(registered trademark by Asahi Glass Co., Ltd.) which is a copolymer offluoroethylene and vinylether; and the like. A height of the bank fromthe substrate is 0.1 to 2 μm and particularly preferably 0.8 to 1.2 μm.

The shape of the bank is preferably a forward tapered shape. The forwardtapered shape means a shape in which a wall surface of the bank isslanted and an area of the bottom surface of the bank is larger than anarea of the upper surface of the bank (See FIG. 1). When the shape ofthe bank is a tapered shape, a taper angle is 20 to 80° and particularlypreferably 35 to 45°.

The bank in the present invention is characterized by having a lowlyophilicity at the upper surface of the bank. The term “upper surfaceof the bank” means a plane including the top of the bank. The lowlyophilicity means that the contact angle of water on at least a part ofthe upper surface of the bank is 80° or more, or preferably 90° or more.Usually, the contact angle of water at the upper surface of the bank is110° or less.

Further, the bank in the present invention is characterized by having ahigh lyophilicity at the bottom surface of the bank. The highlyophilicity means that the contact angle of water on at least a part ofthe bank bottom surface is 70° or less, or preferably 60° or less.

As mentioned above, the lyophilicity of the bank in the presentinvention gradually changes along the thickness direction of the bank.The lyophilicity in the bank is mainly determined by a concentration ofa fluorine atom. Therefore, the lyophilicity gradient along thethickness direction of the bank is obtained by gradually changing thefluorine concentration of the fluorine resin along the thicknessdirection of the bank.

As will be described later, the bank of the present invention may beformed by baking (heating) a film made of a fluorine resin-containingcomposition (bake-treatment) patterned to a desired shape. The presentinventors found that the fluorine concentration of the fluorine resingradually changes along the thickness direction of the bank by makingthe shape of the bank formed with bake-treatment in the forward taperedshape.

In the present invention, the fluorine atom concentration at the uppersurface of the bank is preferably 5 to 10 atoms, while the fluorineconcentration at the bottom surface of the bank is preferably 0 to 3atoms. The fluorine atom concentration is measured by an X-rayphotoelectron spectrometer (also referred to as XPS or ESCA).

A mechanism to gradually change the fluorine concentration of thefluorine resin along the thickness direction of the bank will bedescribed below.

Table 1 is a graph illustrating a relation between the thickness of abank formed by baking (heating) film made of a fluorine resin-containingcomposition (bake-treatment) and the fluorine concentration at the uppersurface of the bank.

TABLE 1 Film Water Anisole Fluorine Thickness Contact ContactConcentration (μm) Angle Angle (atom %) 1 81.2° 45.5° 7.5 0.9 78.9°43.0° 6.9 0.8 76.5° 40.6° 6.3 0.7 74.1° 38.2° 5.6 0.6 71.7° 35.7° 5.00.5 69.4° 33.3° 4.3 0.4 67.0° 30.8° 3.7 0.3 64.6° 28.4° 3.0 0.2 62.2°25.9° 2.4 0.1 59.9° 23.5° 1.7

As shown in Table 1, the thicker the bank becomes, the higher thefluorine concentration on the upper surface of the bank becomes, andboth the water contact angle and the anisole contact angle become larger(lyophilicity is decreased).

In addition, when the bank shape is a forward tapered shape as mentionedabove, a gradient is generated in the thickness at the bank on its wallsurface. That is, as shown in FIG. 1, the bank thickness becomes smallerin the order of 3 a, 3 b, 3 c.

As mentioned above, the concentration of the fluorine component at theupper surface of the thin bank is decreased; and the concentration ofthe fluorine component at the upper surface of thick bank is increased.Therefore, in bank 3 having the forward tapered shape shown in FIG. 1,the fluorine concentration at a spot shown by 3 a (bank thickness islarge) is relatively high, and the fluorine concentration at a spotshown by 3 c (bank thickness is small) is relatively low. Consequently,the fluorine concentration in bank 3 is decreased in the order of 3 a, 3b, 3 c. In FIG. 1, reference numeral 1 denotes a substrate and referencenumeral 2 denotes an electrode.

As mentioned above, by forming the bank having the forward tapered shapewith bake-treatment, the fluorine concentration of the fluorine resingradually changes along the thickness direction of the bank. Inaddition, by gradually changing the fluorine concentration of thefluorine resin along the bank thickness direction, a gradient of thelyophilicity along the thickness direction of the bank is obtained.Therefore, upper surface 3 a of the bank with low lyophilicity plays arole to suppress the leakage of the material of the functional layerdefined by the banks, which is the inherent role of the bank; and sincethe lyophilicity of lower part 3 c of the bank wall surface is high, thefunctional layer (a hole transport layer, an interlayer or an organic ELlayer) is assuredly set over the entire region defined by the banks,that is, up to the edges of the banks.

As mentioned above, by making the shape of the bank made of bakedfluorine resin in the forward tapered shape to set the lyophilicity ofthe bank lower part higher than the lyophilicity of the bank upper part,a functional layer having a uniform thickness is formed in a definedregion without leaving an unapplied spot. Further, by adjusting theshape of the forward taper, the shape of the layer to be formed may becontrolled. For example, the leakage of the functional layer over theregion defined by the banks is prevented by adjusting the taper angle.

Moreover, the bank having the forward tapered shape may have twoinflection points (See FIG. 2). By forming bank in the forward taperedshape with the two inflection points, an angle between bank 3 andelectrode 2 becomes small. Therefore, the ink containing functionallayer material 4 is easily applied to the region defined by the banks,application is made on the whole surface of the defined region withoutleaving an unapplied spot, and a uniform thin film is obtained. In FIG.2, reference numeral 1 denotes a substrate and reference numeral 2denotes an electrode.

The organic EL element of the present invention has a cathode electrodelayer on the organic EL layer. A material of the cathode electrode layeris different depending on whether the organic EL element is of topemission type or of bottom emission type. In the case where the organicEL element is of top emission type, the cathode electrode needs to betransparent, and the cathode electrode is preferably an ITO electrode oran IZO electrode or the like. A buffer layer and the like are preferablyformed between the organic EL layer and the cathode electrode layer. Onthe other hand, in the case where the organic EL element is of bottomemission type, there is no need for the cathode electrode to betransparent, and an electrode may be made of any material.

The organic EL element of the present invention may be sealed by furtherproviding a cover material on the cathode electrode. The cover materialsuppresses the intrusion of moisture and oxygen.

The organic EL element of the present invention may further have anelectrically insulating inorganic film (hereinafter referred to as“inorganic insulating film”). It is needless to say that the inorganicinsulating film is an electrically insulant. The inorganic insulatingfilm also preferably has high lyophilicity. Examples of a material ofthe inorganic insulating film include silicon oxide (SiO₂), siliconnitride (Si₃N₄), silicon oxynitride (SiON) and the like. The thicknessof insulating inorganic film is preferably 10 to 200 nm.

The inorganic insulating film preferably protrudes from the bank to theregion defined by the banks (See FIG. 3). Preferably, the inorganicinsulating film protrudes from the bank by 5 to 10 μm.

In the present invention, a solution containing a material of thefunctional layer (a hole transport layer or an interlayer) is applied onthe inorganic insulating layer protruding from the bank. By theinorganic insulating film with high lyophilicity, the solution isuniformly applied on the entire region defined by the banks to obtainthe functional layer with a uniform film thickness. As mentioned above,in the present invention, the functional layer with more uniformthickness is obtained by combining the lyophilicity of the bankgradually changing along the thickness direction and the inorganicinsulating film.

As mentioned above, the organic EL element of the present invention hasthe inorganic insulating film (optional) protruding from the bank, andthe setting position of the inorganic insulating film may be classifiedinto the following two modes depending on the material of the holetransport layer. The shape and the setting position of the inorganicinsulating film will be described below for each of the two modes.

(1) In the case where a material of the hole transport layer isPEDOT-PSS (See FIG. 3):

The inorganic insulating film in this case is set on the substrate so asto be in contact with the bottom surface of the hole transport layer(See FIG. 3). By forming the inorganic insulating film so as to be incontact with the bottom surface of the hole transport layer, the filmthickness of the hole transport layer made of PEDOT-PSS is made moreuniform.

(2) In the case where a material of the hole transport layer is a metaloxide such as tungsten oxide or the like (See FIG. 4):

In this case, the inorganic insulating film is formed so as to be incontact with the bottom surface of the interlayer (See FIG. 4). Theinorganic insulating film may be set on the hole transport layer (FIG.4A), on the substrate (FIG. 4B), or on the substrate and below the holetransport layer (FIG. 4C), as long as it is formed so as to be incontact with the bottom surface of the interlayer. By forming theinorganic insulating film so as to be in contact with the bottom surfaceof the interlayer, the film thickness of the interlayer formed byapplying the solution containing the material of the interlayer to theregion defined by the banks is made more uniform. In addition, bysetting the inorganic insulating film between the bank and the holetransport layer (FIG. 4A), adhesion between the bank and the holetransport layer made of a metal oxide is improved.

2. Organic EL Display Panel

A plurality of the organic EL elements of the present invention may bearranged in matrix state on substrate 1 so as to constitute the organicEL display panel (See FIG. 5).

The organic EL display panel of the present invention has an organic ELelement comprising a substrate, an anode electrode, a cathode electrode,and transport layer, an interlayer and a light emitting layer sandwichedby the both electrodes. In addition, the organic EL display panel of thepresent invention has a bank.

The organic EL display panel of the present invention has basicconfiguration in which a plurality of the above-mentioned organic ELelements are arranged in matrix state on the substrate, and the anodeelectrode, the bank, the hole transport layer, the interlayer, theorganic EL layer, and the cathode electrode are characterized by havingthe following shapes.

Anode Electrode

When the organic EL display panel is of passive matrix type, a pluralityof the anode electrodes are formed in lines. The line-state anodeelectrodes are preferably in parallel with each other. When the organicEL display panel is of active matrix type, a plurality of the anodeelectrodes are formed in matrix state (for each organic EL element) onthe substrate.

Bank

A plurality of the banks are formed in lines on the substrate and definea line-state regions on the substrate (See FIG. 5). The line-state banksare preferably in parallel with each other. When the anode electrodesare in line state, the line direction of the line-state bank preferablycrosses the line direction of the anode electrodes at a right angle.

In one line-state region defined by the line-state banks, a plurality ofthe organic EL elements lined up in one row are set. On the line-stateregion, a solution containing the material of the functional layer issequentially applied. Hereinafter, the line-state region defined by theline-state banks is referred to as “application region”.

Hole Transport Layer

In the organic EL display panel of the present invention, the holetransport layer is set for each organic EL element separately. That is,the hole transport layers are formed in matrix state (See FIG. 6). Inaddition, the hole transport layers are formed in the above-mentionedapplication region.

Interlayer

The interlayer is set as a single layer in an entire application regionwhich includes plurality of organic EL elements. That is, the interlayeris formed in line in the application region.

Organic EL Layer

The organic EL layer is set as a single layer in an entire applicationregion which includes the plurality of organic EL elements. That is, theorganic EL layer is formed in line in the application region.

The organic EL material is selected as appropriate so that a desiredcolor (red R, green G, blue B) is emitted from each application region.For example, a green pixel is arranged adjacent to a red pixel, a bluepixel is arranged adjacent to the green pixel, and a red pixel isarranged adjacent to the blue pixel (See FIG. 5).

Cathode Electrode

The cathode electrode is formed on the organic EL layer set in eachapplication region and the cathode electrode is usually formed in linein each application region separately (See FIG. 5). Usually, in order toseparate the cathode electrodes formed in the adjacent applicationregions, the line-state banks play roll as a cathode separator. Thecathode electrode does not have to be separated for each applicationregion in some cases. That is, when the anode electrodes areindependently controlled for each pixel as in the active matrix type,the TFT elements for driving the pixel electrode are independent, and aplurality of application regions can share the single cathode electrode.

The organic EL display panel of the present invention may have aninorganic insulating film protruding from the bank into the applicationregion.

When a material of the hole transport layer is PEDOT-PSS, the inorganicinsulating film is set so as to be in contact with the bottom surface ofthe hole transport layer. On the other hand, when the material of thehole transport layer is a metal oxide such as tungsten oxide or thelike, the inorganic insulating film is set so as to be in contact withthe bottom surface of the interlayer.

The organic EL display panel of the present invention may have secondbanks defining a pixel region in the application region (See FIG. 7).Here, the pixel region means an opening in the single organic ELelement. A height of the second bank from the substrate may be the sameas the height of the line-state bank from the substrate, but it ispreferably smaller than the height of the line-state bank from thesubstrate. The height of the second bank from the substrate ispreferably 0.1 to 0.5 μm.

A material of the second bank is not particularly limited as long as itis insulating. A material of the second bank is preferably an insulatingresin. Further, the material of the second bank may be fluorine-resin ornon-fluorine-resin. Therefore, the material of the second bank may be anon-fluorine resin (non-fluorine polyimide resin, non-fluorinepolyacrylic resin, or the like).

At the second banks defining the pixel region, grooves connecting theadjacent pixel regions with each other are provided (See FIG. 7). Thewidth of the groove is preferably 10 to 30 μm, and more preferably 18 to22 μm.

The setting position and function of the second bank are differentdepending on the materials of the hole transport layer. The settingposition of the second bank is described below separately for the casewhere the material of the hole transport layer is PEDOT-PSS and for thecase where it is a metal oxide such as tungsten oxide or the like.

(1) In the case where the material of the hole transport layer isPEDOT-PSS

When the material of the hole transport layer is PEDOT-PSS, the secondbanks define the region of the hole transport layer. That is, when thematerial of the hole transport layer is PEDOT-PSS, the second bank has afunction to prevent intrusion of the solution into the adjacent pixelregion when the solution containing PEDOT-PSS is applied to theapplication region and to define the hole transport layers in matrixstate.

(2) In the case where the material of the hole transport layer is ametal oxide such as tungsten oxide or the like

When the material of the hole transport layer is a metal oxide, thesecond banks define regions of the interlayer and the organic EL layer.In this case, the second bank has a function to increase the yield.

In a manufacturing process of the organic EL display of the presentinvention, dusts might adhere in the application region before theformation of the interlayer or the organic EL layer. As will bedescribed later, the interlayer and the organic EL layer is formed byapplying the material, and if the material of the interlayer or theorganic EL layer is applied in the application region to which the dustsadhere, the applied material is attracted to the dusts and an uncoveredarea (the area not covered with the interlayer or the organic EL layer)is generated in the application region.

On the other hand, when the second banks defining a plurality of pixelregions are set in the application region, the second banks prevent theapplied material of the interlayer or organic EL layer from beingattracted to the dust. Therefore, even if the dusts adhere to theapplication region, an uncovered area is hardly generated in theapplication region. Consequently, the second banks defining theinterlayer and the organic EL layer contribute to the increase of theyield.

In addition, electric cross talk between the pixels may be suppressed bythe second banks. Further, by providing the groove connecting the pixelregions with each other at the second bank, the solution containing thematerial of the interlayer or the organic EL layer can move between thepixel regions, and the thickness of the interlayer or the organic ELlayer to be formed is leveled in the application region.

3. A Manufacturing Method of Organic EL Display Panel

The organic EL display panel of the present invention may bemanufactured by any method as long as the effect of the presentinvention is not impaired. For the organic EL display panel of thepresent invention, the manufacturing method is preferably changedaccording to the material of the hole transport layer.

A manufacturing method of the organic EL display panel is describedbelow separately for the case where the hole transport layer isPEDOT-PSS and for the case where it is a metal oxide such as tungstenoxide or the like.

(1) In the case where the material of the hole transport layer isPEDOT-PSS

When the hole transport layer is made of PEDOT-PSS, the manufacturingmethod of the organic EL display panel of the present inventionpreferably includes the steps of 1) forming an anode electrode on asubstrate; 2) forming line-state banks containing a fluorine resin onthe substrate so that the anode electrode is exposed to define aline-state region (application region); 3) forming matrix-state holetransport layers on the substrate; 4) forming a line-state interlayer inthe application region; 5) forming a line-state organic EL layer in theapplication region; and 6) forming a cathode electrode on the organic ELlayer.

This manufacturing method may further have a step of forming aninorganic insulating film between the 1) step and the 2) step. Theinorganic insulating film is formed with plasma CVD method or sputteringmethod, for example.

In the 1) step, the anode electrode may be formed by forming aconducting thin film on a substrate and patterning it byphotolithography or etching, and the method is not particularly limited.

In the 2) step, the line-state banks are formed using photolithographyor printing technology.

Formation of the banks containing a fluorine resin using thephotolithography technology includes the steps of a) forming a film of aphotosensitive resin composition containing a fluorine resin on asubstrate on which an anode electrode is formed, and b) exposing anddeveloping the film so as to expose part or the whole of the anodeelectrode.

In order to form a film of the photosensitive resin compositioncontaining the fluorine resin on the substrate surface on which theanode electrode is formed, for example a technique such as spin-coating,die-coating, slit-coating or the like can be used to form a film; andthen the formed film is dried. The drying condition is not particularlylimited, and the film may be left for 2 to 3 minutes at 800C.

By exposing and developing the film of the photosensitive resincomposition containing the fluorine resin, the line-state region(application region) is defined, and the anode electrode is exposed. Theshape of the developed film is preferably the forward tapered shape asshown in FIGS. 1 and 2 as mentioned above. The shape of developed filmis controlled by setting the conditions of exposure and development asappropriate.

The developed film is subjected to bake-treatment. By thebake-treatment, a fluorine component of the fluorine resin contained inthe film is considered to be floated to the film surface. The conditionof the bake-treatment is not particularly limited but the temperature isapproximately 200° C. or more and the time is approximately 1 hour, forexample. By this treatment, a bank that has the desired lyophilicity isformed. As mentioned above, by making the shape of the bank the forwardtapered shape, the lyophilicity of the bank is changed according to theheight of the bank.

On the other hand, when a resin film containing the fluorine resin of apredetermined pattern is formed with the printing technology, atechnique such as intaglio printing, letterpress printing or the likemay be used.

In addition, in the example of this manufacturing method, the secondbanks may be formed in the 2) step. In this manufacturing method, thesecond banks define the hole transport layer. In addition, instead ofthe second banks, a water-repellent self assembly monolayer (SAM) may beformed. Examples of such self assembly monolayer material include asilane coupling agent and the like. The self assembly monolayerspreferably define the pixel region similarly to the second banks.Further, the self assembly monolayer is preferably set on the inorganicinsulating film. The pixel regions preferably connect with each otheralso in the case where the self assembly monolayer is formed.

After the banks are formed, the substrate and/or the anode electrodesurface in the application region may be washed by ozone water. Thewashing procedure by the ozone water is not particularly limited, andconcentration of the ozone water may be approximately 0.02 to 20 ppm.More specifically, in the washing procedure the ozone water is drippedonto the application region, and the substrate is spun (at approximately10 rpm). After spinning for approximately 2 minutes, water is drippedwhile the substrate is still being spun and further, isopropyl alcoholor the like is dripped to wash the substrate and/or anode electrode.

By the washing with the ozone water, the bank components adhering to thesubstrate or the anode electrode surface are appropriately removedwithout damaging the baked bank surface. On the other hand, thelyophilicity was conventionally improved by irradiating the applicationregion with ultraviolet rays or plasma (oxygen plasma, for example), butit has been known that the irradiation of the ultraviolet rays or plasmaeasily damages the surface of the baked bank, and the fluorinecomponents of the fluorine resin localized on the surface are removed.Therefore, in the present invention, it is preferable that irradiationof the ultraviolet rays or plasma is not conducted.

As mentioned above, by washing with the ozone water, there are littlebank components (that is, fluorine resin) remaining on the substrate orthe anode electrode surface in the application region. The phrase “thereare little bank components remaining on the substrate or the anodeelectrode surface” means that carbon atom concentration on the substrateor anode electrode surface in the application region is 20 atom % orless, preferably 15 atom % or less, and more preferably 12 atom % orless, for example. In addition, fluorine atom concentration on thesubstrate or anode electrode surface in the application region ispreferably 5 atom % or less. The carbon atom concentration or fluorineatom concentration on the substrate or anode electrode surface may bemeasured by an X-ray photoelectron spectrometer (also referred to as XPSor ESCA) after removing the laminated functional layer so as to exposethe substrate or the anode electrode surface.

In the 3) step, the matrix-state hole transport layers are formed byapplying the solution containing PEDOT-PSS with the ink-jet,die-coating, letterpress printing or the like, for example. The holetransport layer is formed on the anode electrode. In the case where thesecond banks are formed, the matrix-state hole transport layers may beformed by applying the solution containing PEDOT-PSS to the pixel regiondefined by the second banks.

In the 4) step, the line-state interlayer is formed with ink-jet,die-coating, letterpress printing or the like in the application region.

In the 5) step, ink containing the organic EL material and a solvent isapplied to the application region. The application may be carried outusing a technique such as ink-jet, dispenser, nozzle coating, intaglioprinting, letterpress printing or the like. When ink is applied with thedispenser, ink discharge from the dispenser is preferably controlled bysuck-back operation or the like at the beginning and the end of thelinewise application. The thickness of the applied ink (thickness of thecoat film) may be approximately 1 to 10 μm. Further, a layer containingthe organic EL material is formed by drying the coat film.

In the 6) step, the cathode electrode is formed on the organic EL layer.The cathode electrode may be formed with a deposition method.

(2) In the case where the hole transport layer is a metal oxide such astungsten oxide or the like

When the hole transport layer is made of a metal oxide such as tungstenoxide or the like, the manufacturing method of the organic EL displaypanel of the present invention preferably includes the steps of 1)forming the anode electrode on the substrate; 2) forming thematrix-state hole transport layers on the substrate; 3) forming theline-state banks containing the fluorine resin on the substrate so thatthe hole transport layer is exposed to define the application region; 4)forming the line-state interlayer in the application region; 5) formingthe organic EL layer in the application region; and 6) forming thecathode electrode on the organic EL layer.

This manufacturing method may have a step of forming an inorganicinsulating film between the 2) step and the 3) step.

The step of forming the anode electrode on the substrate surface, thestep of forming the line-state interlayer and organic EL layer, and thestep of forming the cathode electrode in this manufacturing method arethe same as those in the manufacturing method of the above (1) and theymay be carried out by the same means.

In the 2) step, the matrix-state hole transport layers made of a metaloxide such as tungsten oxide or the like are formed on the substrate.The matrix-state hole transport layers may be formed by forming a layermade of a metal oxide such as tungsten oxide or the like on thesubstrate by a sputtering method or a heating deposition method andthen, etching the layer in matrix state to pattern it in matrix state.The hole transport layer is formed on the anode electrode.

In the 3) step, the line-state banks containing the fluorine resin areformed on the substrate on which the anode electrode and the holetransport layer are formed so as to expose the hole transport layer. Theforming method of the bank may be the same as the forming method of thebank in the manufacturing method of (1).

The second banks may be formed in the same step when the line-statebanks containing a fluorine resin are formed or after the step when theline-state banks containing a fluorine resin are formed. In thismanufacturing method, the second banks define the regions of theinterlayer and the organic EL layer. Instead of the second banks, theself assembly monolayer may be formed.

Further, after the banks are formed, the exposed hole transport layermay be washed with ozone water. The washing method with the ozone watermay be the same as the washing method with the ozone water in themanufacturing method of (1).

By the washing with the ozone water, there are little bank components(that is, fluorine resin) remaining on the substrate or the holetransport layer surface in the application region. The phrase “there arelittle bank components remaining on the substrate or the hole transportlayer surface” means that carbon atom concentration on the substrate orhole transport layer surface in the application region is 20 atom % orless, preferably 15 atom % or less, and more preferably 12 atom % orless, for example. In addition, fluorine atom concentration on thesubstrate or hole transport layer surface in the application region ispreferably 5 atom % or less. The carbon atom concentration or fluorineatom concentration on the substrate or hole transport layer surface maybe measured by an X-ray photoelectron spectrometer (also referred to asXPS or ESCA) after removing the laminated functional layer so as toexpose the substrate or the hole transport layer surface.

In the 4) step, the interlayer is formed in the line-state applicationregion, and in the 5) step, the organic EL layer is formed in theline-state application region. The forming method of the interlayer andthe organic EL layer may be the same as the forming method of theinterlayer and the organic EL layer in the manufacturing method of (1).

In the case where the second banks are formed, the forming method of theinterlayer and the organic EL layer includes a step of applying thesolution containing the materials of the interlayer or the organic ELlayer to the pixel region defined by the second banks.

4. Organic Semiconductor Element

The organic semiconductor element of the present invention has asubstrate, a source electrode, a drain electrode, and an organicsemiconductor layer.

The source electrode and the drain electrode may be set so as to form agap between the source electrode and the drain electrode. A gap distancebetween the source electrode and the drain electrode is usually severalμm. The materials of the source electrode and the drain electrode arenot particularly limited but are a conductive metal, a conductivepolymer or the like. Examples of the conductive metal include molybdenumMo, tungsten W, aluminum Al, chromium Cr, Titanium Ti, Gold Au, and analloy of them. The source electrode and the drain electrode may be amulti-layered metal film of different kinds of metals.

The source electrode and the drain electrode on the substrate and aregion connecting the both electrodes are covered by a semiconductorlayer (channel) containing an organic semiconducting material. Examplesof the organic semiconducting material include a low-molecular organicsemiconducting material such as pentacene, tetracene, a phthalocyaninecompound or the like; a polymeric organic semiconducting material suchas polythiophene, polyphenylenevinylene or the like; carbon nanotubes;and others. The organic semiconductor element of the present inventionpreferably has a polymeric organic semiconducting material.

The semiconductor layer is preferably formed by applying a polymericorganic semiconducting material to a region defined by the banks.

The banks defining the semiconductor layer are characterized bycontaining a fluorine resin similar to the organic EL element. Amaterial of the bank in the semiconductor element of the presentinvention may be the same as the material of the bank in the organic ELelement. In addition, the lyophilicity of the bank gradually changesalong the thickness direction of the bank. That is, the lyophilicity onthe upper surface of the bank is preferably low, and the lyophilicity onthe bottom surface of the bank is preferably high.

The lyophilicity gradient along the bank thickness direction is obtainedby making the shape of the baked bank the forward tapered shape asmentioned above.

As a result, the ink containing the material of the semiconductor layerapplied to the region defined by the banks is applied appropriately upto the edge of the bank, and the semiconductor layer having a uniformthickness is obtained. Thereby, channel characteristics of thesemiconductor layer are improved.

After the banks are formed, the electrode and substrate exposed in theregion defined by the banks may be washed with ozone water before theformation of the semiconductor layer. The washing method with the ozonewater may be the same as the washing method with the ozone water in themanufacturing method of the organic EL display panel. By the washingwith the ozone water, the semiconductor layer is formed on a cleanerelectrode surface.

In the organic semiconductor of the present invention, a gate electrodecontrolling a channel, which channel is the organic semiconductor layer,is set. The gate electrode may be a back-gate electrode, a top-gateelectrode or other types of gate electrodes. An organic semiconductorelement may further comprise an overcoat layer for protecting theorganic semiconductor layer.

Embodiment 1

In Embodiment 1, the organic EL element of the present invention will bedescribed.

FIG. 2 shows an example of the organic EL element of the presentinvention. The organic EL element shown in FIG. 2 has substrate 1, anodeelectrode 2, bank 3, hole transport layer 4, interlayer 5, organic ELlayer 6, and cathode electrode 7.

As mentioned above, in the case where the organic EL element is ofbottom emission type, materials of substrate 1 and anode electrode 2 arepreferably transparent; in the case where the organic EL element is oftop emission type, the material of cathode electrode 7 is madetransparent and the material of anode electrode 2 is preferably amaterial with high reflectivity.

A work function of a surface of anode electrode 2 in contact with holetransport layer 4 is preferably controlled to 5.1 to 5.5 eV in order tomake it easier for holes to be injected. The work function of the metalanode electrode means the required minimum energy to take out a singleelectron from the electrode surface to the outside.

Hole transport layer 4, interlayer 5, and organic EL layer 6 arepreferably made of a polymeric organic material. That is because all ofthe layers is preferably formed with an application method.

Bank 3 is characterized by containing a fluorine resin. A color of bank3 is not particularly limited, and it may be black. By setting the bankwith a color having high contrast to the light from the light emittinglayer (black, for example), the brightness may be increased.

As in FIG. 2, bank 3 has the forward tapered shape, the lyophilicity onlower part of the bank is high, while the lyophilicity on upper part ofthe bank is low as mentioned above. Further, bank 3 has the forwardtapered shape and has two inflection points. That is, a contact angle ofbank 3 with anode electrode 2 is small. Therefore, particularly whenhole transport layer 4 is manufactured by the application method, theink containing the hole injection material is appropriately applied upto the edge of the bank, and a layer having a more uniform thickness maybe obtained easily. Therefore, light is easily emitted from the entiresurface of the light emitting layer, and aperture ratio is increased.

Embodiment 2

In Embodiment 2, the organic EL display panel of an active matrix typewill be described. In this embodiment, a material of the hole transportlayer is PEDOT-PSS.

FIG. 5 is a plan view of the organic EL display panel of the activematrix type. On the panel shown in FIG. 5, a plurality of banks 3 formedin lines are set. Banks 3 define application regions 10. Applicationregions 10 are classified into application region 10R emitting redlight; application region 10G emitting green light; and applicationregion 10B emitting blue light, and they are set in order. Applicationregion 10 is covered by cathode electrode 7. Cathode electrode 7 isseparated by banks 3 for each application region 10.

Bank 3 is characterized by containing a fluorine resin. A color of bank3 is not particularly limited, and it may be black. By setting the bankwith a color having high contrast to the light emission from the lightemitting layer (black, for example), the brightness may be increased.Though not shown, the shape of the bank is preferably a forward taperedshape.

FIG. 6 is a plan view of the organic EL display panel of the activematrix type in this embodiment, from which the cathode electrode, theorganic EL layer, and the interlayer are removed. As shown in FIG. 6, inpixel region 11 defined by second banks 3′, hole transport layer 4 isset. As a result, hole transport layers 4 are arranged in matrix stateon substrate 1. In addition, second bank 3′ has a groove connectingpixel regions 11 with each other.

FIG. 7A shows a sectional view taken along line A-A of the organic ELdisplay panel of this embodiment shown in FIG. 5. FIG. 7B shows asectional view taken along line B-B of the organic EL display panel ofthis embodiment shown in FIG. 5.

As shown in FIG. 7A, inorganic insulating film 8 is set so as to be incontact with the bottom surface of hole transport layer 4. By inorganicinsulating film 8, when hole transport layer 4 is formed by applyingPEDOT-PSS to pixel region 11, the film thickness of hole transport layer4 is made more uniform.

As shown in FIG. 7B, hole transport layer 4 is separately set on eachanode electrode 2 so as to cover anode electrode 2. On the other hand,interlayer 5 and organic EL layer 6 are set over the plurality oforganic EL elements in application region 10.

Embodiment 3

In Embodiment 2, the organic EL display panel in which the material ofthe hole transport layer is PEDOT-PSS was described. In Embodiment 3,the organic EL display panel in which the material of the hole transportlayer is a metal oxide such as tungsten oxide or the like will bedescribed.

A plan view of the organic EL display panel of this embodiment is thesame as the plan view of the organic EL display panel of Embodiment 2.Therefore, FIG. 5 is also the plan view of this embodiment.

FIG. 8A shows a sectional view taken along line A-A of the organic ELdisplay panel of this embodiment shown in FIG. 5. FIG. 8B shows asectional view taken along line B-B of the organic EL display panel ofthis embodiment shown in FIG. 5.

As shown in FIGS. 8A and 8B, the organic EL display panel of thisembodiment is the same as the organic EL display panel of Embodiment 2except for the setting position of inorganic insulating film 8.Therefore, the same reference numerals are given to the same members asthose in the organic EL display panel of Embodiment 2, and thedescription will be omitted.

As shown in FIG. 8A, in the organic EL display panel of this embodiment,inorganic insulating film 8 is set so as to be in contact with thebottom surface of interlayer 5. In this embodiment, since the materialof the hole transport layer is a metal oxide such as tungsten oxide orthe like so that the hole transport layer is not formed with theapplication method. Therefore, in this embodiment, inorganic insulatingfilm 8 plays a role to make the film thickness of interlayer 5 formedwith the application method uniform.

Embodiment 4

In Embodiment 4, the organic semiconductor element will be described.

FIG. 9 illustrates an example of the organic semiconductor element ofthe present invention. The organic semiconductor element shown in FIG. 9is a so-called “back-gate type” thin film transistor and has substrate21, back-gate electrode 22, source electrode 23, drain electrode 24,bank 25, organic semiconductor layer 26, and overcoat layer 27. It isneedless to say that the organic semiconductor element of the presentinvention may be of top-gate type.

Bank 25 is characterized by containing a fluorine resin. Similar to FIG.2, since bank 25 shown in FIG. 9 has the forward tapered shape, thelyophilicity on lower part of the bank is high and the lyophilicity onupper part of the bank is low. In addition, bank 25 has the forwardtapered shape and has two inflection points. That is, the contact angleof bank 25 to source electrode 23 and drain electrode 24 is small.

Therefore, when organic semiconductor layer 26 is manufactured by theapplication method, the ink containing the organic semiconductingmaterial may be appropriately applied up to the edge of the bank, alayer with more uniform thickness is easily obtained, and thinning ofthe film is also realized. Thus, the channel characteristics of organicsemiconductor layer 26 are improved (including improvement of mobilityand improvement of ON/OFF ratio)

The present application claims priority based on Japanese PatentApplication No. 2007-145877 filed on May 31, 2007. The contentsdescribed in this description of the application are all incorporatedherein by reference.

INDUSTRIAL APPLICABILITY

The organic EL element of the present invention has the function to makethe organic functional layer exert appropriately. That is, the thicknessof the functional layer is made constant and functional deteriorationdue to impurities such as the bank components or the like is suppressed.The organic device of the present invention is used as the organicsemiconductor element or the organic EL element or the like, forexample.

EXPLANATION OF REFERENCE NUMERALS

-   1 SUBSTRATE-   2 ANODE ELECTRODE-   3 BANK-   3′ SECOND BANK-   4 HOLE TRANSPORT LAYER-   5 INTERLAYER-   6 ORGANIC EL LAYER-   7 CATHODE ELECTRODE-   8 inorganic insulating film-   10 application region-   11 pixel region-   20 ORGANIC SEMICONDUCTOR ELEMENT-   21 SUBSTRATE-   22 GATE ELECTRODE-   23 SOURCE ELECTRODE-   24 DRAIN ELECTRODE-   25 BANK-   26 ORGANIC SEMICONDUCTOR LAYER-   27 overcoat LAYER

1. An organic EL display panel comprising: a substrate; anode electrodesset on the substrate line-state banks defining a line-state region andcomprising a fluorine resin set on the substrate; hole transport layersarranged in matrix state on the substrate, the hole transport layersbeing set in the line-state region; a line-state interlayer set in theline-state region; a line-state organic EL layer set in the line-stateregion; and cathode electrodes provided on the organic EL layer; whereinthe line-state banks contain a fluorine resin; a fluorine concentrationof the fluorine resin gradually changes along a thickness direction ofthe line-state banks; and the fluorine concentration at a top of each ofthe line-state banks is higher than the fluorine concentration at abottom surface thereof.
 2. The organic EL display panel according toclaim 1 further comprising insulating inorganic films, wherein amaterial of the hole transport layers comprisespolyethylenedioxythiophene; and the insulating inorganic films protrudefrom the line-state banks into the line-state region and are in contactwith bottom surfaces of the hole transport layers.
 3. The organic ELdisplay panel according to claim 1, further comprising insulatinginorganic films, wherein a material of the hole transport layerscomprises tungsten oxide (WO_(x)), molybdenum oxide (MoO_(x)), vanadiumoxide (VO_(x)) or a combination of them; and the insulating inorganicfilms protrude from the line-state banks into the line-state region andare in contact with a bottom surface of the line-state interlayer. 4.The organic EL display panel according to claim 1 further comprisingsecond banks defining two or more pixel regions in the line-stateregion, wherein a material of the hole transport layers comprisespolyethylenedioxythiophene; the pixel regions define the hole transportlayers; the second banks each have a groove connecting the pixel regionswith each other; and heights of the second banks from the substrate aresmaller than heights of the line-state banks from the substrate.
 5. Theorganic EL display panel according to claim 1 further comprising secondbanks defining two or more pixel regions in the line-state region,wherein a material of the hole transport layers contains comprisestungsten oxide (WO_(x)), molybdenum oxide (MoO_(x)), vanadium oxide(VO_(x)) or a combination of them; the pixel regions define theline-state interlayer and the organic EL layer; the second banks eachhave a groove connecting the pixel regions with each other; and heightsof the second banks from the substrate are smaller than heights of theline-state banks from the substrate.
 6. (canceled)
 7. The organic ELdisplay panel according to claim 1, wherein the fluorine concentrationat the top of each of the line-state banks is 5 to 10 atom % and thefluorine concentration at the bottom surface thereof is 0 to 3 atom %.8. The organic EL display panel according to claim 1, wherein theline-state banks are in a forward tapered shape.
 9. A manufacturingmethod of an organic EL display panel comprising: forming anodeelectrodes on a substrate; forming line-state banks comprising afluorine resin and defining a line-state region on the substrate so asto expose the anode electrodes; forming matrix-state hole transportlayers on the substrate, a material of the hole transport layerscomprising polyethylenedioxythiophene; forming a line-state interlayerin the line-state region; applying an ink comprising an organic ELmaterial and a solvent to the line-state region with ink-jet, dispenser,nozzle coating, intaglio printing or letterpress printing to form aline-state organic EL layer in the line-state region; and formingcathode electrodes on the organic EL layer, wherein a fluorineconcentration of the fluorine resin gradually changes along a thicknessdirection of the line-state banks; and the fluorine concentration at atop of each of the line-state banks is higher than the fluorineconcentration at a bottom surface thereof.
 10. The manufacturing methodaccording to claim 9, wherein forming the line-state banks comprisingthe fluorine resin on the substrate includes comprises: forming a filmof a photosensitive resin composition comprising the fluorine resin onthe substrate; exposing and developing the film of the photosensitiveresin composition comprising the fluorine resin to expose the anodeelectrodes partly or completely; and baking the developed film of thephotosensitive resin composition comprising the fluorine resin.
 11. Themanufacturing method according to claim 9 further comprising washing theexposed anode electrodes with ozone water.
 12. The manufacturing methodaccording to claim 9 further comprising forming second banks definingtwo or more pixel regions in the line-state region, wherein the secondbanks each have a groove connecting the pixel regions with each other;heights of the second banks from the substrate are smaller than heightsof the line-state banks from the substrate; and forming the matrix-statehole transport layers comprises applying a solution comprisingpolyethyelenedioxythiophene to the pixel regions.
 13. The manufacturingmethod according to claim 9 further comprising forming self assemblymonolayers defining two or more pixel regions in the line-state region,wherein forming the matrix-state hole transport layers comprisesapplying a solution comprising polyethyelenedioxythiophene to the pixelregions.
 14. A manufacturing method of an organic EL display panelcomprising: forming anode electrodes on a substrate; formingmatrix-state hole transport layers on the substrate, a material of thehole transport layers comprising tungsten oxide (WO_(x)), molybdenumoxide (MoO_(x)), vanadium oxide (VO_(x)) or a combination of them;forming line-state banks comprising a fluorine resin and defining aline-state region on the substrate so as to expose the hole transportlayers; forming a line-state interlayer in the line-state region;applying an ink comprising an organic EL material and a solvent to theline-state region with ink-jet, dispenser, nozzle coating, intaglioprinting or letterpress printing to form a line-state organic EL layerin the line-state region; and forming cathode electrodes on the organicEL layer, wherein a fluorine concentration of the fluorine resingradually changes along a thickness direction of the line-state banks;and the fluorine concentration at a top of each of the line-state banksis higher than the fluorine concentration at a bottom surface thereof.15. The manufacturing method according to claim 14, wherein forming theline-state banks comprising the fluorine resin on the substratecomprises: forming a film of a photosensitive resin compositioncomprising the fluorine resin on the substrate; exposing and developingthe film of the photosensitive resin composition comprising the fluorineresin to expose the hole transport layers partly or completely; andbaking the developed film of the photosensitive resin compositioncomprising the fluorine resin.
 16. The manufacturing method according toclaim 14 further comprising washing the exposed hole transport layerswith ozone water.
 17. The manufacturing method according to claim 14further comprising forming second banks defining two or more pixelregions in the line-state region, wherein the second banks each have agroove connecting the pixel regions with each other; heights of thesecond banks from the substrate are smaller than heights of theline-state banks from the substrate; forming the line-state interlayercomprises applying a solution comprising a material of the line-stateinterlayer to the pixel regions; and forming the organic EL layercomprises applying an ink comprising an organic EL material and asolvent to the pixel regions.
 18. The manufacturing method according toclaim 14 further comprising the step of forming self assembly monolayersdefining two or more pixel regions in the line-state region, whereinforming the line-state interlayer comprises applying a solutioncomprising a material of the line-state interlayer to the pixel regions,and forming the organic EL layer comprises applying an ink comprising anorganic EL material and a solvent to the pixel regions.
 19. An organicEL element comprising a substrate, an anode electrode formed on thesubstrate, an organic EL layer formed on the anode electrode, and a bankdefining a region of the organic EL layer, wherein the bank comprises afluorine resin and a fluorine concentration of the fluorine resingradually changes along a thickness direction of the bank, and thefluorine concentration at a top of the bank is higher than the fluorineconcentration at a bottom surface of the bank.
 20. The organic ELelement according to claim 19, wherein the fluorine concentration at thetop of the bank is 5 to 10 atom % and the fluorine concentration at thebottom surface of the bank is 0 to 3 atom %.